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FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE)
A4K SERIES
1. PART NO. EXPRESSION :
A4K300-RE-10
(a)(b)(c) (d) (e) (f) (g)
(a) Series code (b) Dimension code (c) Material code (d) Impedance code : 300 = 30
(e) R : Reel (f) Current code : E = 500mA (g) 10 : Lead Free
2. CONFIGURATION & DIMENSIONS :
A J D2
G I
L
C
H
PCB Pattern
D1 P B
Unit:m/m D2 P G 0.80 Ref. H 0.40 Ref. I 0.80 Ref. J 2.80 Ref. L 2.20~2.60
A
B
C
D1
3.200.20 1.600.20 0.900.20 0.400.15 0.200.10 0.800.10
3. SCHEMATIC :
4. MATERIALS : b a
Ag(100%) Ni(100%)-1.5um(min.) Sn(100%)-3.0um(min.)
(a) Body : Ferrite (b) Termination : Ag/Ni/Sn
5. GENERAL SPECIFICATION : a) Temp. rise : 30C Max. b) Rated current : Base on temp. rise c) Storage temp. : -55C to +125C d) Operating temp. : -55C to +125C e) Resistance to solder heat : 260C.10secs
NOTE : Specifications subject to change without notice. Please check our website for latest information.
18.06.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE)
A4K SERIES
6. ELECTRICAL CHARACTERISTICS : Part Number A4K300-RE-10 A4K600-RD-10 A4K121-RD-10 A4K301-RC-10 A4K601-RB-10 A4K102-RB-10 Impedance () 30 25% 60 25% 120 25% 300 25% 600 25% 1000 25% Test Frequency ( MHz ) 100 100 100 100 100 100 DC Resistance () Max. 0.20 0.25 0.30 0.40 0.50 0.75 Rated Current ( mA ) Max. 500 400 350 250 200 150
NOTE : Specifications subject to change without notice. Please check our website for latest information.
18.06.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE)
A4K SERIES
7. IMPEDANCE VS. FREQUENCY CURVES :
A4K300-RE-10
A4K600-RD-10
A4K121-RD-10
A4K301-RC-10
A4K601-RB-10
A4K102-RB-10
NOTE : Specifications subject to change without notice. Please check our website for latest information.
18.06.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE)
A4K SERIES
8. RELIABILITY & TEST CONDITION :
ITEM
Electrical Characteristics Test Impedance DC Resistance Rated Current Temperature Rise Test Solder Heat Resistance
PERFORMANCE
TEST CONDITION
HP4291A, HP4287A+16192A HP4338B 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Preheat : 150C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 2605C Flux for lead free : rosin Dip Time : 100.5sec. 260C
150C
Refer to standard electrical characteristics list
30C max. ( t) Appearance : No significant abnormality Impedance change : Within 30% No mechanical damage Remaining terminal electrode : 70% Min.
Preheating Dipping
Natural cooling
60 seconds
100.5 seconds
Solderability
More than 90% of the terminal electrode should be covered with solder.
Preheat : 150C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 2305C Flux for lead free : rosin Dip Time : 41sec. 230C
150C
Preheating Dipping
Natural cooling
60 seconds
41.0 seconds
Terminal Strength
The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions.
For A Series : Size 4 Force (Kfg) 0.5 Time (sec) > 25
W
W
Flexture Strength
The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions.
20(.787) Bending 45(1.772) 45(1.772) 40(1.575)
Solder a chip on a test substrate, bend the substrate by 2mm (0.079in) and return.
100(3.937)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
18.06.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE)
A4K SERIES
8. RELIABILITY & TEST CONDITION :
ITEM
Loading at High Temperature
PERFORMANCE
Appearance : No damage. Impedance : Within 30% of initial value.
TEST CONDITION
Temperature : 1255C Applied Current : rated current Duration : 50012hrs Measured at room temperature after placing for 2 to 3hrs. Humidity : 90~95% RH. Temperature : 402C Duration : 50012hrs Measured at room temperature after placing for 2 to 3hrs.
Humidity
Thermal Shock
Appearance : No damage. Impedance : Within 30% of initial value. Phase 1 2 Temperature (C) -552C +1255C Times (min.) 303 303
For A Series : Condition for 1 cycle Step1 : -552C 303 min. Step2 : +1255C 303 min. Number of cycles : 5 Measured at room temperature after placing for 2 to 3hrs. Temperature : -552C Duration : 50012hrs Measured at room temperature after placing for 2 to 3hrs.
Measured : 5 times Low temperature storage test
NOTE : Specifications subject to change without notice. Please check our website for latest information.
18.06.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE)
A4K SERIES
9. SOLDERING AND MOUNTING : 9-1. Recommended PC Board Pattern
2.8
PC board should be designed so that products are not sufficient under mechanical stress as warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure.
2.2 - 2.6
0.8 0.8
0.4
9-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 9-2.1 Lead Free Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 9-2.2 Solder Wave : Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature seen by the circuit when immersed in the molten solder wave, typical at 230C. Due to the risk of thermal damage to products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering is shown in Fig. 2 9-2.3 Soldering Iron (Figure 3) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : d) 1.0mm tip diameter (max) a) Preheat circuit and products to 150C. e) Use a 20 watt soldering iron with tip diameter of 1.0mm b) 350C tip temperature (max) f) Limit soldering time to 3 secs. c) Never contact the ceramic with the iron tip
Preheating Soldering Natural cooling Preheating Soldering Natural cooling
TEMPERATURE C
10s max.
250 ~ 260 230 180 150
TEMPERATURE C
260 245 150
60~120s
30~60s
Time(sec.) Figure 1. Re-flow Soldering
Preheating Soldering
3s (max.) 10s (max.)
Over 2min.
Gradual Cooling Within 3s
TEMPERATURE C
Natural cooling
Figure 2. Wave Soldering
350 330 150
Over 1min.
Gradual Cooling
Figure 3. Hand Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
18.06.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE)
A4K SERIES
9-3. Solder Volume Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 4.
Upper limit Recommendable
t
Figure 4
NOTE : Specifications subject to change without notice. Please check our website for latest information.
18.06.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 7
FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE)
A4K SERIES
10. PACKAGING INFORMATION : 10-1. Reel Dimension
A
Type 7" x 8mm
D B C
A(mm) 9.00.5
B(mm) 60.02.0 60.02.0
C(mm)
D(mm)
13.50.5 178.02.0 13.50.5 178.02.0
7" x 12mm 13.50.5
20.5
13.50.5 R10.5
7" x 8mm
7" x 12mm
R1.9
R0.5
120
10-2 Tape Dimension / 8mm
P2:20.05 E:1.750.1 Po:40.1 D:1.5+0.1 A W:8.00.1 t
Series
Size 1
Bo(mm)
Ao(mm)
Ko(mm)
P(mm) 2.00.1 4.00.1 4.00.1 4.00.1 4.00.1 4.00.1 4.00.1
t(mm) 0.230.05 0.220.05 0.220.05 0.220.05 0.220.05 0.220.05 0.220.05
D1(mm) none none 1.00.1 1.00.1 1.00.1 1.00.1 1.00.1
1.120.05 0.670.05 0.540.05 1.800.10 1.010.10 1.020.10 2.250.10 1.420.10 1.040.10 2.350.10 1.500.10 1.450.10 3.500.10 1.880.10 1.270.10 3.420.10 2.770.10 1.550.10 3.400.10 1.770.10 1.040.10
F:3.50.05
2
Bo
Z
3 (09) 3 (12)
P
A D1:10.1
Ao
Ko
Section A-A
A
4 5 4
10-2.1 Tape Dimension / 12mm
D:1.5+0.1 E:1.750.1 A W:12.00.1 Po:40.1 P2:20.05 t
Series
Size 6
Bo(mm) 4.950.1 4.950.1 6.100.1
Ao(mm) 1.930.1 3.660.1 5.400.1
Ko(mm) 1.930.1 1.850.1 2.000.1
P(mm) 4.00.1 8.00.1 8.00.1
t(mm) 0.240.05 0.240.05 0.300.05
D1(mm) 1.50.1 1.50.1 1.50.1
F:5.50.05
Bo
Z
7 8
A D1:1.50.1
P
Ao
Ko
Section A-A
10-3. Packaging Quantity Chip Size Chip / Reel Inner Box Middle Box Carton Bulk (Bags) 8 1000 4000 20000 40000 7000 7 1000 4000 20000 40000 12000 6 2000 8000 40000 80000 20000 5 2500 12500 62500 125000 30000 4 3000 15000 75000 150000 50000 3 (12) 2000 10000 50000 100000 100000 3 (09) 4000 20000 100000 200000 150000 2 4000 20000 100000 200000 200000 1 10000 50000 250000 500000 300000
NOTE : Specifications subject to change without notice. Please check our website for latest information.
18.06.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 8
FERRITE CHIP BEADS 4 LINE ARRAY (NORMAL USAGE)
A4K SERIES
10-4. Tearing Off Force F 165 to 180 Top cover tape The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions.
Room Temp. (C) 5~35 Room Humidity (%) 45~85 Room atm (hPa) 860~1060 Tearing Speed (mm/min) 300
Base tape
Application Notice
1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : -10 ~ 40C and 30 ~ 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
18.06.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 9

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